AN-V-236
2024-04
Antimony stabilizer in an electroless Ni bath
Straightforward determination of Sb(III) over a wide concentration range with the scTRACE Gold
Summary
Electroless nickel plating offers excellent wear and corrosion resistance. Producing printed circuit boards begins with electroless nickel coating, either via the ENIG (electroless nickel, immersion gold) or ENEPIG (electroless nickel, electroless palladium, immersion gold) process. Monitoring the stabilizer levels in electroless Ni plating baths is crucial to ensure uniform nickel deposits and high-quality coatings. The typical concentration of antimony(III) stabilizer in an electroless Ni bath is around 1 mg/L.
Anodic stripping voltammetry is a fast and robust tool for monitoring the Sb(III) stabilizer concentration in electroless Ni plating bath samples. This determination is performed on a combined sensor containing working, reference, and auxiliary electrodes integrated on a single ceramic substrate: the scTRACE Gold. The sensor does not need extensive maintenance such as mechanical polishing. This method is suited for manual or automated systems.
Sample
Electroless Ni plating bath
Experimental
Add water, the electroless Ni plating bath sample, and the supporting electrolyte into the measuring vessel. The determination of antimony(III) is carried out with the 884 Professional VA (Figure 1) using the parameters specified in Table 1. The concentration is determined by two additions of an antimony(III) standard addition solution.
The scTRACE Gold is electrochemically activated prior to the first determination.
Parameter | Setting |
---|---|
Mode | DP – Differential Pulse |
Deposition potential | -0.1 V |
Deposition time | 30 s |
Start potential | -0.1 V |
End potential | 0.2 V |
Peak potential Sb(III) | 0.06 V |
Electrodes
- scTRACE Gold
Results
With a 30 s deposition time, this method is suitable for the determination of antimony(III) in electroless Ni plating bath samples over a wide concentration range when the dilution factor is adapted.
Sample | Sb(III) (mg/L) |
---|---|
Electroless Ni plating bath containing 1 mg/L Sb(III) | 0.971 |
Internal reference: AW VA CH-0619-122022